1
GATE ECE 2014 Set 3
Numerical
+1
-0
At T = 300 K, the hole mobility of a semiconductor $$\mu_p\;=500\;cm^2/V-s$$ and $$\frac{kT}q\;=\;26\;mV$$.The hole diffusion constant Dp in cm2/s is__________.
Your input ____
2
GATE ECE 2014 Set 3
MCQ (Single Correct Answer)
+1
-0.3
In MOSFET fabrication, the channel length is defined during the process of
A
Isolation oxide growth
B
Channel stop implantation
C
Poly-silicon gate patterning
D
Lithography step leading to the contact pads
3
GATE ECE 2014 Set 3
Numerical
+2
-0
For the MOSFET M1 shown in the figure, assume W/L =2, VDD = 2.0 V, $$\mu n$$ COX = 100$$\mu {\rm A}/{V^2}$$ and VTH =0.5 V. The transistor M1 switches from saturation region to linear regionm when Vin(in Volts) is _____ GATE ECE 2014 Set 3 Electronic Devices and VLSI - IC Basics and MOSFET Question 20 English
Your input ____
4
GATE ECE 2014 Set 3
Numerical
+2
-0
An ideal MOS capacitor has boron doping concentration of 1015 cm-3 in the substrate. When a gate voltage is applied, a depletion region of width 0.5 $$\mu m$$ is formed with a surface (channel) potential of 0.2V. Given that $${\varepsilon _0} = 80854 \times {10^{ - 14}}F/cm$$ and the relative permittivities of silicon and silicon dioxide are 12 and 4, respectively, the peak electric field (in V/ $$\mu m$$ ) in the oxide region is ______
Your input ____